ELECTRONIC MATERIALS

Analysis of individual electronic components and printed circuit boards by scanning electron and optical microscopy, including cross-sectional examination, can assist investigation of potential areas of failure.

Cross sectioning and ultra high magnification imaging of printed circuit boards, connectors and components; including integrated circuits, capacitors, LEDs etc; can reveal details of failure mechanisms. Typical investigations include chemical attack/corrosion, with identification of agents such as flux or cleaning chemicals; contact failure between component and circuit, for example by fracture of solder joints; and tin whiskers, resulting from the use of lead free solders, leading to shorts.

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